High-speed interconnect using 1.3 um laser and fiber array

Sherman Zhu; Toshi Uchida; Takuhori Tani

doi:10.1117/12.271457

10 April 1997 High-speed interconnect using 1.3 um laser and fiber array

Sherman Zhu, Toshi Uchida, Takuhori Tani

Proceedings Volume 3038, High-Speed Semiconductor Lasers for Communication; (1997) https://doi.org/10.1117/12.271457
Event: Photonics West '97, 1997, San Jose, CA, United States

Abstract

Multifiber optic interconnects are attractive for high- throughput computer systems and asynchronous transfer mode (ATM) switching systems. We have developed a high- performance 10-fiber interconnect with each fiber operating at a high speed of 1 Gb/s. The modules have a receptacle for mechanically transferred push-on (MTP) multifiber push pull connector. The hermetic package is surface mount type and solder reflowable. The transmitter (Tx) is dc-coupled and the receiver (Rx) is ac-coupled with a cutoff of 7 kHz. The electrical interface is differential current mode logic (CML) or emitter coupled logic (ECL), and the optical interface is a 12-fiber connector. Single-mode glass fibers (9.5 micrometer) or multimode glass graded-index fibers (62.5 micrometer) were used. Tx contains a laser-driver IC, while Rx contains pre-amplifier and postamplifier, and comparator circuits. All the ICs are minus 5.2 V bipolar GaAs, and Tx plus RX consumes 4 W. The power in a fiber is about 100 (mu) W. The back-to-back skew is less than 80 ps. For a non-return-to-zero (NRZ) 2²³-1 pseudo-random bit stream, the error rate was less than 10 ^-12 with all the channels transmitting different signals simultaneously and a 100-m small-skew (1.2 ps/m) fiber ribbon. The link worked up to an atmosphere temperature of 80 degrees Celsius.

Citation Download Citation

Sherman Zhu, Toshi Uchida, and Takuhori Tani "High-speed interconnect using 1.3 um laser and fiber array", Proc. SPIE 3038, High-Speed Semiconductor Lasers for Communication, (10 April 1997); https://doi.org/10.1117/12.271457

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