Reactivity and kinetic parameters for UVIIHS

Gregory M. Wallraff; Juliann Opitz; William D. Hinsberg; Frances A. Houle; James W. Thackeray; Theodore H. Fedynyshyn; Doris Kang; Martha M. Rajaratnam

doi:10.1117/12.275851

7 July 1997 Reactivity and kinetic parameters for UVIIHS

Gregory M. Wallraff, Juliann Opitz, William D. Hinsberg, Frances A. Houle, James W. Thackeray, Theodore H. Fedynyshyn, Doris Kang, Martha M. Rajaratnam

Author Affiliations +

Proceedings Volume 3049, Advances in Resist Technology and Processing XIV; (1997) https://doi.org/10.1117/12.275851
Event: Microlithography '97, 1997, Santa Clara, CA, United States

Abstract

The 'developable' chemical image generated in chemically amplified DUV resists is only indirectly related to the photochemical image generated on exposure. As a consequence the factors which ultimately affect the performance of the resist are determined by the thermally activated reactions occurring after the exposure step. For this reason it is important to understand the details of this chemistry in order to understand the effects that changes in formulation and process conditions have on factors such as linewidth and process latitude. In this report we describe studies on the deprotection reactions which occur in films of UVIIHS during the post exposure bake step. Experimentally measured deprotection rate data are compared to simulations employing a stochastic mechanism simulator.

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Gregory M. Wallraff, Juliann Opitz, William D. Hinsberg, Frances A. Houle, James W. Thackeray, Theodore H. Fedynyshyn, Doris Kang, and Martha M. Rajaratnam "Reactivity and kinetic parameters for UVIIHS", Proc. SPIE 3049, Advances in Resist Technology and Processing XIV, (7 July 1997); https://doi.org/10.1117/12.275851

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