New vacuum packaging method of field emission display

Byeong-Kwon Ju; Woo-Beom Choi; S. J. Jeong; Nam Young Lee; Jeong-In Han; K. I. Cho; Myung-Hwan Oh

doi:10.1117/12.293566

14 November 1997 New vacuum packaging method of field emission display

Byeong-Kwon Ju, Woo-Beom Choi, S. J. Jeong, Nam Young Lee, Jeong-In Han, K. I. Cho, Myung-Hwan Oh

Proceedings Volume 3242, Smart Electronics and MEMS; (1997) https://doi.org/10.1117/12.293566
Event: Far East and Pacific Rim Symposium on Smart Materials, Structures, and MEMS, 1997, Adelaide, Australia

Abstract

Two ITO-coated glass wafers are successfully bonded by the typical Si-Pyrex electrostatic bonding mechanism. Both Si- 7740 and Ti-(Li-doped SiO$02)) interlayer systems can be employed for the electrostatic bonding of 7059-7059 and 0080-0080 glass wafer pairs. This glass-to-glass electrostatic bonding process can be applied to the clean and tubeless packaging of field emission display panels.

Citation Download Citation

Byeong-Kwon Ju, Woo-Beom Choi, S. J. Jeong, Nam Young Lee, Jeong-In Han, K. I. Cho, and Myung-Hwan Oh "New vacuum packaging method of field emission display", Proc. SPIE 3242, Smart Electronics and MEMS, (14 November 1997); https://doi.org/10.1117/12.293566

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