Thin film Au-Sn bonding for optoelectronic integration

John J. Callahan; Timothy J. Drabik; Kevin P. Martin; Chi Fan

doi:10.1117/12.305490

20 April 1998 Thin film Au-Sn bonding for optoelectronic integration

John J. Callahan, Timothy J. Drabik, Kevin P. Martin, Chi Fan

Proceedings Volume 3289, Micro-Optics Integration and Assemblies; (1998) https://doi.org/10.1117/12.305490
Event: Optoelectronics and High-Power Lasers and Applications, 1998, San Jose, CA, United States

Abstract

Eutectic bonding employing vacuum-deposited Au and Sn precursor layers, and based on a novel process, can effect quasi-monolithic hybridization of thin-film III-V devices with silicon substrates.

Citation Download Citation

John J. Callahan, Timothy J. Drabik, Kevin P. Martin, and Chi Fan "Thin film Au-Sn bonding for optoelectronic integration", Proc. SPIE 3289, Micro-Optics Integration and Assemblies, (20 April 1998); https://doi.org/10.1117/12.305490

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