CVD diamond TEM sample preparation by laser machining

James E. Butler; D. J. Vestyck Jr.; A. Gilmore; J. W. Steeds

doi:10.1117/12.328198

20 October 1998 CVD diamond TEM sample preparation by laser machining

James E. Butler, D. J. Vestyck Jr., A. Gilmore, J. W. Steeds

Proceedings Volume 3484, Lasers in Synthesis, Characterization, and Processing of Diamond; (1998) https://doi.org/10.1117/12.328198
Event: Lasers in Synthesis, Characterization, and Processing of Diamond, 1997, Tashkent, Uzbekistan

Abstract

The defect structure of diamond films grown by microwave plasma chemical vapor deposition (CVD) in studied by using laser machining to slice thin sections from free standing films ca. 200 microns thick. This technique has enabled the examination of the defects at the nucleation and growth surface of optically clear CVD diamond films. A cw Q- switched Nd³⁺/YAG laser was used to slice 1 to 15 micron thick wedges, ca. 3mm in length from 150 to 220 micron thick diamond films. The edges of the as cut wedges were thin enough for examination by transmission electron microscopy. Subsequent ion milling was used to thin the edges further. Remarkably low defect densities are observed at the growth surface after 150 microns of growth.

Citation Download Citation

James E. Butler, D. J. Vestyck Jr., A. Gilmore, and J. W. Steeds "CVD diamond TEM sample preparation by laser machining", Proc. SPIE 3484, Lasers in Synthesis, Characterization, and Processing of Diamond, (20 October 1998); https://doi.org/10.1117/12.328198

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