Paper
5 July 2000 Mask error factor impact on the 130-nm node
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Abstract
The aggressive schedule for downscaling of gate dimensions and need for tight CD control for the 130nm node has created the need to seriously consider the use of a Levenson phase shift mask with 248nm lithography tools. The improvements in exposure latitude and depth of focus of strong phase shift over binary patterning are well known and have been clearly demonstrated. What is less well understood is the impact of the mask error factor.
© (2000) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
John N. Randall, Christopher C. Baum, Keeho Kim, and Mark E. Mason "Mask error factor impact on the 130-nm node", Proc. SPIE 4000, Optical Microlithography XIII, (5 July 2000); https://doi.org/10.1117/12.389049
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Cited by 1 scholarly publication.
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KEYWORDS
Phase shifts

Binary data

Photomasks

Optical proximity correction

Reticles

Optical lithography

Semiconducting wafers

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