Measurement of thermal deformation of IC packages using the AFM scanning moire technique

Zhaowei Zhong; Yunguang Lu; Huimin Xie; Bryan Kok Ann Ngoi; Jin Yu; Gin Boay Chai; Anand Krishna Asundi

doi:10.1117/12.404871

23 October 2000 Measurement of thermal deformation of IC packages using the AFM scanning moire technique

Zhaowei Zhong, Yunguang Lu, Huimin Xie, Bryan Kok Ann Ngoi, Jin Yu, Gin Boay Chai, Anand Krishna Asundi

Proceedings Volume 4229, Microelectronic Yield, Reliability, and Advanced Packaging; (2000) https://doi.org/10.1117/12.404871
Event: International Symposium on Microelectronics and Assembly, 2000, Singapore, Singapore

Abstract

The scanning moire method was suggested in 1980s. A scanning moire method using optical method was proposed in 1993. The scanning lines in the SEM monitor or CCD video camera were utilized as the reference grating to form a scanning moire pattern. The available results are limited to the deformation measurement by using a grating with a frequency less than 250 lines/mm. Thus it is impossible to apply this method to measure deformation in nanometer scale. With the development of micro-mechanics and the appearance of nanometer mechanics, new techniques for deformation measurement form micrometer to nanometer scales are in urgent need.

Citation Download Citation

Zhaowei Zhong, Yunguang Lu, Huimin Xie, Bryan Kok Ann Ngoi, Jin Yu, Gin Boay Chai, and Anand Krishna Asundi "Measurement of thermal deformation of IC packages using the AFM scanning moire technique", Proc. SPIE 4229, Microelectronic Yield, Reliability, and Advanced Packaging, (23 October 2000); https://doi.org/10.1117/12.404871

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