Paper
27 December 2001 Manufacturing-induced residual stresses in optical glasses and crystals: Example of residual stress relief by magnetorheological finishing (MRF) in commercial silicon wafers
John C. Lambropoulos, Steven R. Arrasmith, Stephen D. Jacobs, Donald Golini
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Abstract
The Twyman effect refers to the generation by grinding of residual compressive stresses on the surface of a brittle material. Two issues are the correlation of stress-induced deformation (bowing) with the compressive force, and the depth over which the compressive stress acts. We summarize results from optical glasses, and we then apply a new analysis to optical crystals, specifically silicon. The issue of grinding-induced stress depth is addressed by demonstrating the relief of lapping-induced stresses in commercial Si wafers by magnetorheological finishing (MRF). MRF is a novel process that is effective for fine figuring and polishing of a variety of optical glasses and crystals. We demonstrate that MRF is suitable for finishing the surfaces of electronic grade single crystal silicon wafers. Four inch diameter <111> silicon wafers were loose abrasive lapped with various sized abrasives. The lapping- induced stress in the wafer surface was extracted by interferometrically measuring the curvature of the wafer due to the Twyman effect. Subsequent polishing by MRF was found to be effective in removing the associated residual stress generated in the wafer surface during loose abrasive lapping. The lapping-induced residual stresses are largest near the lapped surface, decaying with a characteristic length of 0.4-0.5 micrometers into the lapped surface.
© (2001) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
John C. Lambropoulos, Steven R. Arrasmith, Stephen D. Jacobs, and Donald Golini "Manufacturing-induced residual stresses in optical glasses and crystals: Example of residual stress relief by magnetorheological finishing (MRF) in commercial silicon wafers", Proc. SPIE 4451, Optical Manufacturing and Testing IV, (27 December 2001); https://doi.org/10.1117/12.453618
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Cited by 6 scholarly publications and 2 patents.
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KEYWORDS
Semiconducting wafers

Surface finishing

Silicon

Magnetorheological finishing

Glasses

Polishing

Abrasives

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