Paper
2 October 2001 Parametric monitoring for the SUMMiT V surface-micromachining process
Andrew D. Oliver, Danelle M. Tanner, Seethambal S. Mani, Scott E. Swanson, Karen S. Helgesen, Norman F. Smith
Author Affiliations +
Proceedings Volume 4558, Reliability, Testing, and Characterization of MEMS/MOEMS; (2001) https://doi.org/10.1117/12.443008
Event: Micromachining and Microfabrication, 2001, San Francisco, CA, United States
Abstract
This paper reports on a set of parametric monitors for Sandia National Laboratories SUMMiT V (TM) (Sandia Ultra-planar Multi-level MEMS `i' Technology) five-level polysilicon surface micromachining process. Parametric monitors are typically used to monitor changes in the process due to either process drifts or intentional process changes. These parametric monitors are one of three types: electrical, electromechanical, or stress. In this paper we report on the design and characterization of these devices as well as how these devices are used to quantify the characteristics of the SUMMiT VTM process. We will demonstrate the use of these parametric devices in defining a baseline process.
© (2001) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Andrew D. Oliver, Danelle M. Tanner, Seethambal S. Mani, Scott E. Swanson, Karen S. Helgesen, and Norman F. Smith "Parametric monitoring for the SUMMiT V surface-micromachining process", Proc. SPIE 4558, Reliability, Testing, and Characterization of MEMS/MOEMS, (2 October 2001); https://doi.org/10.1117/12.443008
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CITATIONS
Cited by 3 scholarly publications.
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KEYWORDS
Resistance

Resonators

Actuators

Surface micromachining

Diagnostics

Photography

Scanning electron microscopy

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