Paper
8 October 2001 Three-dimensional microstructuring of Pyrex glass wafers by spark-assisted chemical etching
Hans H. Langen, V. Fascio, R. Wuethrich, D. Viquerat
Author Affiliations +
Proceedings Volume 4568, Microrobotics and Microassembly III; (2001) https://doi.org/10.1117/12.444139
Event: Intelligent Systems and Advanced Manufacturing, 2001, Boston, MA, United States
Abstract
A fabrication technology is introduced for rapid structuring of glass components with microtools. The machining occurs in the vicinity of the tool tip in a NaOH solution without the necessity of mask design and lithography steps. The whole setup can be arranged on a table top unit outside the clean room. Especially the research field of MEMS or (mu) TAS could profit from this technology. The micro structures are drilled or milled into the glass substrates by spark assisted chemical etching (SACE) using micro tools that are dressed on the machine itself to correct for errors due to tool mounting (eccentricity and attitude). This tool processing is done with wire electrodischarge grinding (WEDG). A newly developed prototype is introduced that reduces the development time of micro devices that make use of glass components (Pyrex glass or quartz). Some research results on SACE are presented.
© (2001) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Hans H. Langen, V. Fascio, R. Wuethrich, and D. Viquerat "Three-dimensional microstructuring of Pyrex glass wafers by spark-assisted chemical etching", Proc. SPIE 4568, Microrobotics and Microassembly III, (8 October 2001); https://doi.org/10.1117/12.444139
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Cited by 3 scholarly publications.
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KEYWORDS
Glasses

Wet etching

Electrodes

Prototyping

Plasma

3D microstructuring

Cameras

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