Laser-based sample preparation for electronic package failure analysis

Brandon M. Frazier; Scott A. Mathews; Michael T. Duignan; Lars D. Skoglund; Zhiyong Wang; Rajen C. Dias

doi:10.1117/12.470645

18 June 2002 Laser-based sample preparation for electronic package failure analysis

Brandon M. Frazier, Scott A. Mathews, Michael T. Duignan, Lars D. Skoglund, Zhiyong Wang, Rajen C. Dias

Proceedings Volume 4637, Photon Processing in Microelectronics and Photonics; (2002) https://doi.org/10.1117/12.470645
Event: High-Power Lasers and Applications, 2002, San Jose, California, United States

Abstract

Failure analysis has come to play a key role in ensuring quality and reliability in semiconductor devices, associated packaging and printed wiring boards. Tools are increasingly available to those investigating high-density integrated circuits at the die level, particularly for edit and repair operations. Until recently however, this capability has been limited by the inherent low-resolution mechanical/manual processes used for destructive analysis on electronics packaging. A laser-based tool has been developed to selectively and locally enable access to traces and layers within packages and provide a way to perform edits to an area of interest.

Citation Download Citation

Brandon M. Frazier, Scott A. Mathews, Michael T. Duignan, Lars D. Skoglund, Zhiyong Wang, and Rajen C. Dias "Laser-based sample preparation for electronic package failure analysis", Proc. SPIE 4637, Photon Processing in Microelectronics and Photonics, (18 June 2002); https://doi.org/10.1117/12.470645

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