Hybrid glass structures for telecommunication applications

Robert D. Simpson; Joseph S. Hayden; Samuel D. Conzone; Berton Callicoatt; Alexana Roshko; Norman A. Sanford

doi:10.1117/12.431629

18 June 2002 Hybrid Glass Structures for Telecommunication Applications

Robert D. Simpson, Joseph S. Hayden, Samuel D. Conzone, Berton Callicoatt, Alexana Roshko, Norman A. Sanford

Proceedings Volume 4640, Integrated Optics: Devices, Materials, and Technologies VI; (2002) https://doi.org/10.1117/12.431629
Event: Symposium on Integrated Optoelectronic Devices, 2002, San Jose, California, United States

Abstract

Hybrid glass parts composed of dissimilar glass sections are an attractive route to integrate multiple functions onto a single substrate and offer the potential to fabricate advanced laser sources, amplifiers, lossless splitters and other photonic devices such as Fabry-Perot etalons. We review the most promising bonding technologies, placing particular emphasis on techniques that do not require the use of high processing temperatures. In particular, we discuss in detail a recently developed low temperature bonding technology that relies on inorganic adhesives. Characterization of interfacial joints prepared with this inorganic technology indicate low insertion loss, high mechanical strength and chemical resistance to attack during the conventional lithographic and ion exchange steps employed to fabricate waveguide structures.

Citation Download Citation

Robert D. Simpson, Joseph S. Hayden, Samuel D. Conzone, Berton Callicoatt, Alexana Roshko, and Norman A. Sanford "Hybrid Glass Structures for Telecommunication Applications", Proc. SPIE 4640, Integrated Optics: Devices, Materials, and Technologies VI, (18 June 2002); https://doi.org/10.1117/12.431629

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