Polysilicon surface-micromachined spatial light modulator with novel electronic integration

Clara E. Dimas; Thomas G. Bifano; Paul A. Bierden; Julie A. Perreault; Peter A. Krulevitch; Ryan T. Roehnelt; Steven Cornelissen

doi:10.1117/12.462846

19 April 2002 Polysilicon surface-micromachined spatial light modulator with novel electronic integration

Clara E. Dimas, Thomas G. Bifano, Paul A. Bierden, Julie A. Perreault, Peter A. Krulevitch, Ryan T. Roehnelt, Steven Cornelissen

Author Affiliations +

Proceedings Volume 4755, Design, Test, Integration, and Packaging of MEMS/MOEMS 2002; (2002) https://doi.org/10.1117/12.462846
Event: Symposium on Design, Test, Integration, and Packaging of MEMS/MOEMS 2002, 2002, Cannes-Mandelieu, France

Abstract

This paper presents a high-speed resolution phase-only microelectromechanical system (MEMS) spatial light modulator (SLM), integrated with driver electronics, using through- wafer vias and solder bump bonding. It employs a polysilicon thin film MEMS technology that is well suited to micromirror array fabrication and offers significant improvement in SLM speed in comparison to alternative modulator technologies. Vertical through-wafer interconnections offer scalability required to achieve 1M-pixel array size. The design, development, fabrication and characterization of a scalable driver integrated SLM is discussed. Pixel opto- electromechanical performance has been quantified experimentally on prototypes, and results are reported.

Citation Download Citation

Clara E. Dimas, Thomas G. Bifano, Paul A. Bierden, Julie A. Perreault, Peter A. Krulevitch, Ryan T. Roehnelt, and Steven Cornelissen "Polysilicon surface-micromachined spatial light modulator with novel electronic integration", Proc. SPIE 4755, Design, Test, Integration, and Packaging of MEMS/MOEMS 2002, (19 April 2002); https://doi.org/10.1117/12.462846

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