Paper
26 November 2002 Reduction in leakage current of InGaN-based light-emitting diodes by N2O plasma passivation
Hyun Min Kim, Chul Huh, Seong-Ju Park
Author Affiliations +
Abstract
The effect of N2O plasma treatment on the reverse leakage currents of InGaN/GaN multiple-quantum well (MQW) light-emitting diodes (LEDs) was investigated. The reverse leakage current of MQW LED chip treated with an N2O plasma was decreased by about 3 orders of magnitude at low reverse voltages compared to that of untreated sample. This could be attributed to the passivation of surface and sidewall damages that were produced by the dry etching process to obtain a reliable pattern transfer. These results suggest that the nonradiative leakage current MQW LED chip can be greatly reduced by N2O plasma passivation, resulting in an improvement in the performance and reliability of MQW LED chip.
© (2002) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Hyun Min Kim, Chul Huh, and Seong-Ju Park "Reduction in leakage current of InGaN-based light-emitting diodes by N2O plasma passivation", Proc. SPIE 4776, Solid State Lighting II, (26 November 2002); https://doi.org/10.1117/12.452566
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Cited by 5 scholarly publications.
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KEYWORDS
Light emitting diodes

Plasma

Plasma treatment

NOx

Dry etching

Gallium nitride

Electronic components

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