Paper
13 November 2002 Resonant-typed microscanners fabricated by hybrid PZT deposition process on SOI wafers
Author Affiliations +
Proceedings Volume 4936, Nano- and Microtechnology: Materials, Processes, Packaging, and Systems; (2002) https://doi.org/10.1117/12.469675
Event: SPIE's International Symposium on Smart Materials, Nano-, and Micro- Smart Systems, 2002, Melbourne, Australia
Abstract
Resonant-typed microscanners based on a silicon diaphragm and actuated by PZT was designed and fabricated on purpose to improve the deformed microstructure while resonating at high frequency. In order to yield large actuating force, hybrid PZT deposition process: sol-gel method and laser ablation was developed to manufacture thick PZT films with well-crystallized perovskite phase for the applications of microscanners. In our previous study, a sol-gel derived PZT was used due to the high film quality, large deposition area and easy composition control. However, to make a thick and crack-free PZT film, several times of coating and thermal treatment is not only time consumption, but increases the risk of contamination and leads the complicated problem of thermal residual stress. In this paper, the hybrid-derived PZT film with thickness of 3 μm was prepared with simplified steps and reduced processing time. Regarding to the performance of microscanners, 1D scan motion with straight patterns and scan angle of 8±1° has been demonstrated, while resonating with 7 Vp at resonance frequency (2325 Hz). The 2D scan pattern with area of (8±1°)×(5±1°) and less deformed edged was also obtained successfully due to the improvement of the silicon-based flat mirror surface.
© (2002) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Jiunn-Jye Tsaur, Zhanjie Wang, Lulu Zhang, Masaaki Ichiki, Ryutaro Maeda, and Tadatomo Suga "Resonant-typed microscanners fabricated by hybrid PZT deposition process on SOI wafers", Proc. SPIE 4936, Nano- and Microtechnology: Materials, Processes, Packaging, and Systems, (13 November 2002); https://doi.org/10.1117/12.469675
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Cited by 7 scholarly publications.
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KEYWORDS
Ferroelectric materials

Mirrors

Sol-gels

Silicon

Laser ablation

Semiconducting wafers

Polarization

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