Analysis of laser drilling process for substrate by optical simulation rectified at the ablation rate

Katsuichi Ukita; Yasuhiro Mizutnai; Daisuke Yokohagi; Koki Ichihashi; Hidehiko Karasaki

doi:10.1117/12.541163

18 November 2003 Analysis of laser drilling process for substrate by optical simulation rectified at the ablation rate

Katsuichi Ukita, Yasuhiro Mizutnai, Daisuke Yokohagi, Koki Ichihashi, Hidehiko Karasaki

Proceedings Volume 5063, Fourth International Symposium on Laser Precision Microfabrication; (2003) https://doi.org/10.1117/12.541163
Event: Fourth International Symposium on Laser Precision Microfabrication, 2003, Munich, Germany

Abstract

The shape of a processed hole is a key factor for laser drilling system. There are many studies to calculate the behavior of heat or the reaction of molecules in a substrate after laser irradiation. These simulations enable calculation of removed volume by laser power. However, there were some difficulties to estimate the shape of processed hole. To solve the problem, the shape of processed hole was calculated by optical simulation and the ablation rate. The laser intensity distribution on the substrate was calculated by optical simulation considered with diffraction of beam and the aberrations of optics. Furthermore the results of optical simulation were rectified by ablation rate. The calculated shape of the processed hole showed good agreement with actual. This simulation can be used to control the laser drilling process to realize high quality holes.

Citation Download Citation

Katsuichi Ukita, Yasuhiro Mizutnai, Daisuke Yokohagi, Koki Ichihashi, and Hidehiko Karasaki "Analysis of laser drilling process for substrate by optical simulation rectified at the ablation rate", Proc. SPIE 5063, Fourth International Symposium on Laser Precision Microfabrication, (18 November 2003); https://doi.org/10.1117/12.541163

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