Laser cutting of aluminum nitride

Leonard R. Migliore; Arzu Ozkan

doi:10.1117/12.540743

18 November 2003 Laser cutting of aluminum nitride

Leonard R. Migliore, Arzu Ozkan

Proceedings Volume 5063, Fourth International Symposium on Laser Precision Microfabrication; (2003) https://doi.org/10.1117/12.540743
Event: Fourth International Symposium on Laser Precision Microfabrication, 2003, Munich, Germany

Abstract

Aluminum nitride (AN) is beginning to replace alumina as a substrate and heat sink for electronic circuits. The thermal conductivity of A1N, about 8 times that of alumina, is the primary reason for its selection in these applications. While beryllium oxide has even higher conductivity, concerns about that material's toxicity reduce its appeal. Alumina is easily scribed and cut with carbon dioxide lasers. The high thermal conductivity that makes AIN useful, however, makes it difficult to machine with a laser because the material can absorb considerable incident energy without melting or vaporizing. Process settings that produce good results with alumina are not suitable for AIN. It is therefore necessary to develop a new processing regime for aluminum nitride. We cut 0.7 mm thick aluminum nitride sheet with a carbon dioxide laser using a large matrix of process variables and examined the resulting edges for surface quality, microcracking, aluminum deposition and recast. With this information, we defined the volume in process space where effective processing can be accomplished.

Citation Download Citation

Leonard R. Migliore and Arzu Ozkan "Laser cutting of aluminum nitride", Proc. SPIE 5063, Fourth International Symposium on Laser Precision Microfabrication, (18 November 2003); https://doi.org/10.1117/12.540743

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