Semiconductor sidewall shape estimation using top-down CD-SEM image retrieval

Jeffery R. Price; Philip R. Bingham; Kenneth W. Tobin Jr.; Thomas P. Karnowski

doi:10.1117/12.514963

1 May 2003 Semiconductor sidewall shape estimation using top-down CD-SEM image retrieval

Jeffery R. Price, Philip R. Bingham, Kenneth W. Tobin Jr., Thomas P. Karnowski

Proceedings Volume 5132, Sixth International Conference on Quality Control by Artificial Vision; (2003) https://doi.org/10.1117/12.514963
Event: Quality Control by Artificial Vision, 2003, Gatlinburg, TE, United States

Abstract

We present modifications to a feature-based, image-retrieval approach for estimating semiconductor sidewall (cross-section) shapes using top-down images. The top-down images are acquired by a critical dimension scanning electron microscope (CD-SEM). The proposed system is based upon earlier work with several modifications. First, we use only line-edge, as opposed to full-line, sub-images from the top-down images. Secondly, Gabor filter features are introduced to replace some of the previously computed features. Finally, a new dimensionality reduction algorithm - direct, weighted linear discriminant analysis (DW-LDA) - is developed to replace the previous two-step principal component analysis plus LDA method. Results of the modified system are presented for data collected across several line widths, line spacings, and CD-SEM tools.

Citation Download Citation

Jeffery R. Price, Philip R. Bingham, Kenneth W. Tobin Jr., and Thomas P. Karnowski "Semiconductor sidewall shape estimation using top-down CD-SEM image retrieval", Proc. SPIE 5132, Sixth International Conference on Quality Control by Artificial Vision, (1 May 2003); https://doi.org/10.1117/12.514963

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