Microspectrometer on a chip (MICROSPOC): first demonstration on a 320x240 LWIR HgCdTe focal plane array

Sylvain Rommeluere; Nicolas Guerineau; Joel Deschamps; Eric De Borniol; Alain Million; Jean-Paul Chamonal; Gerard Destefanis

doi:10.1117/12.542040

30 August 2004 Microspectrometer on a chip (MICROSPOC): first demonstration on a 320x240 LWIR HgCdTe focal plane array

Sylvain Rommeluere, Nicolas Guerineau, Joel Deschamps, Eric De Borniol, Alain Million, Jean-Paul Chamonal, Gerard Destefanis

Author Affiliations +

Proceedings Volume 5406, Infrared Technology and Applications XXX; (2004) https://doi.org/10.1117/12.542040
Event: Defense and Security, 2004, Orlando, Florida, United States

Abstract

By measuring the spectral responses of infrared focal plane arrays (IRFPAs), one can extract at a given wavelength the cartography of the pixels responses, called the hyperspectral cartography. Recently, hyperspectral cartographies have been obtained from IRFPAs that exhibited small defects of substrate thickness. These defects produce Fizeau fringes across the FPA. By purposely amplifying this phenomenon during the process of realisation, one can easily generate a good approximation of a two-beam interferometer in the immediate neighbourhood of the FPA. Like a classic Michelson interferometer with tilted plane mirrors, this on-a-chip interferometer produces a spatially-modulated interferogram, the Fourier-transform of which yields the spectral content of the illuminating beam. A first prototype of this Fourier-transform microspectrometer on a chip (MICROSPOC) has been realised and tested. Experimental results will be presented and the potential of this approach will be discussed.

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Sylvain Rommeluere, Nicolas Guerineau, Joel Deschamps, Eric De Borniol, Alain Million, Jean-Paul Chamonal, and Gerard Destefanis "Microspectrometer on a chip (MICROSPOC): first demonstration on a 320x240 LWIR HgCdTe focal plane array", Proc. SPIE 5406, Infrared Technology and Applications XXX, (30 August 2004); https://doi.org/10.1117/12.542040

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