Paper
8 October 2004 Cut-off characteristic of CBN and diamond stick stones with pulsed YAG laser: laser cutting of superabrasive stone
Tatsuaki Furumoto, Takashi Ueda, Yoshinori Funada, Yoshiaki Onchi
Author Affiliations +
Proceedings Volume 5662, Fifth International Symposium on Laser Precision Microfabrication; (2004) https://doi.org/10.1117/12.596727
Event: Fifth International Symposium on Laser Precision Microfabrication, 2004, Nara, Japan
Abstract
In this Paper, laser cutting of super abrasive thin stick stone (SATSS) whose grains are CBN and diamond using Nd:YAG laser is studied. We have investigated cutting characteristics of SATSS and strength of the heat affected zone (HAZ) on the surface cut with laser. As a result, SATSS of 3 mm in thickness can be cut off with the width of 0.2 mm in maximum, and there is no chipping at the edge of the surface cut with laser. In the case of CBN stick stone, cutting time with laser is 2.5 times faster than that with diamond blade, and 15 times faster in the case of diamond one. There is a HAZ with a thickness of 0.05 mm. In this HAZ, the abrasive grains are oxidized and their crystal structures are changed by the heat of laser irradiation. However, laser is absorbed effectively by the HAZ, and the HAZ raises the strength of SATSS because the pores inside of the HAZ are closed by the re-solidified vitrified bond. From these results, it is shown that laser cutting can apply to the manufacturing of the SATSS and improve the productivity and the quality.
© (2004) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Tatsuaki Furumoto, Takashi Ueda, Yoshinori Funada, and Yoshiaki Onchi "Cut-off characteristic of CBN and diamond stick stones with pulsed YAG laser: laser cutting of superabrasive stone", Proc. SPIE 5662, Fifth International Symposium on Laser Precision Microfabrication, (8 October 2004); https://doi.org/10.1117/12.596727
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KEYWORDS
Diamond

Laser cutting

Laser irradiation

Surface finishing

Abrasives

Absorption

Pulsed laser operation

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