High-power diode laser bonding process between tape-carrier package and a glass panel with anisotropic conductive film

Gi-Jung Nam; Meong-Hui Seo; Yun-Suk Hong; Sang-Yup Lee; Sung-Wook Moon; Kwang-Hyun Ryu; Nam-Ic Kwon; No-Heung Kwak

doi:10.1117/12.596307

8 October 2004 High-power diode laser bonding process between tape-carrier package and a glass panel with anisotropic conductive film

Gi-Jung Nam, Meong-Hui Seo, Yun-Suk Hong, Sang-Yup Lee, Sung-Wook Moon, Kwang-Hyun Ryu, Nam-Ic Kwon, No-Heung Kwak

Author Affiliations +

Proceedings Volume 5662, Fifth International Symposium on Laser Precision Microfabrication; (2004) https://doi.org/10.1117/12.596307
Event: Fifth International Symposium on Laser Precision Microfabrication, 2004, Nara, Japan

Abstract

A bonding process between tape-carrier package and a glass panel with anisotropic conductive film (ACF) is tested preliminarily by making use of high power diode laser as a heat source for curing. Laser transient thermal simulation was also carried out to analyze thermal response of the assembly process for a package using ACF. Bonding layers consist of polyimide film, copper bump, ACF, ITO and glass plate. The results from modeling of process and from optical properties of layers showed that heat absorbed from polyimide film surface and ACF layer is dominant source of curing during laser illumination. The temperature on ACF layer goes up to 180°C within 1 sec. The temperature in depth shows a decrease of about 17% from polyimide film surface to the bottom of glass plate, but a constant temperature in ACF layer. It is confirmed by experiment that laser should be irradiated periodically in order to maintain the temperature in the range of 175 - 185°C for curing. New ACF bonding processes by making use of high power diode laser are proposed.

Citation Download Citation

Gi-Jung Nam, Meong-Hui Seo, Yun-Suk Hong, Sang-Yup Lee, Sung-Wook Moon, Kwang-Hyun Ryu, Nam-Ic Kwon, and No-Heung Kwak "High-power diode laser bonding process between tape-carrier package and a glass panel with anisotropic conductive film", Proc. SPIE 5662, Fifth International Symposium on Laser Precision Microfabrication, (8 October 2004); https://doi.org/10.1117/12.596307

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