Etching of micro- and nano-structures in semiconductor and glass material systems

Gregg T. Borek; Jared A. Shafer; Lamarr R. Simmons

doi:10.1117/12.600789

22 January 2005 Etching of micro- and nano-structures in semiconductor and glass material systems

Gregg T. Borek, Jared A. Shafer, Lamarr R. Simmons

Proceedings Volume 5720, Micromachining Technology for Micro-Optics and Nano-Optics III; (2005) https://doi.org/10.1117/12.600789
Event: MOEMS-MEMS Micro and Nanofabrication, 2005, San Jose, California, United States

Abstract

Modern optoelectronic devices require micro and nano-structures to be etched into a wide range of substrate materials. The ability to plasma etch a wide range of semiconductor and glass materials is required to produce devices that provide technical solutions to challenging optical designs for optoelectronic applications. This paper addresses the etching practices developed primarily for microoptical devices including lenses and gratings. The materials considered are compound semiconductors in the III-V materials group as well as high index of refraction optical glasses. Many of the materials investigated were evaluated for optical data storage applications for future generation devices.

Citation Download Citation

Gregg T. Borek, Jared A. Shafer, and Lamarr R. Simmons "Etching of micro- and nano-structures in semiconductor and glass material systems", Proc. SPIE 5720, Micromachining Technology for Micro-Optics and Nano-Optics III, (22 January 2005); https://doi.org/10.1117/12.600789

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