A combined fiber optic digital shearography and holography system for defect inspection in Si-wafers

Ganesha Udupa; Jun Wang; Bryan Kok Ann Ngoi

doi:10.1117/12.621526

12 April 2005 A combined fiber optic digital shearography and holography system for defect inspection in Si-wafers

Ganesha Udupa, Jun Wang, Bryan Kok Ann Ngoi

Proceedings Volume 5852, Third International Conference on Experimental Mechanics and Third Conference of the Asian Committee on Experimental Mechanics; (2005) https://doi.org/10.1117/12.621526
Event: Third International Conference on Experimental Mechanics and Third Conference of the Asian Committee on Experimental Mechanics, 2004, -, Singapore

Abstract

The present work relates to surface and/or subsurface defects inspection system for semiconductor industries and particularly to an inspection system for a defect such as swirl defects and particles in an unpolished silicon wafer before the wafer fabrication process by a combined fiber optic digital shearography and holography technique. The dual purpose camera described in this paper gives the possibility of using either digital shearography or holography (DSPI) techniques depending on application needs. The sub-surface defects in a wafer normally create strain concentrations subjected to loading (stressing) which are translated into anomalies in the fringe pattern. A real time technique with the use of Lab view Express 7 software is developed to detect defects in Si-wafer with the application of thermal oading as a stressing method. The results obtained by applying a real time fiber optic shearography technique are described in this paper. The method described here relates specifically to semiconductor wafers, but may be generalized to any other samples.

Citation Download Citation

Ganesha Udupa, Jun Wang, and Bryan Kok Ann Ngoi "A combined fiber optic digital shearography and holography system for defect inspection in Si-wafers", Proc. SPIE 5852, Third International Conference on Experimental Mechanics and Third Conference of the Asian Committee on Experimental Mechanics, (12 April 2005); https://doi.org/10.1117/12.621526

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available