Finite element study of flip chip on board in drop test

Siew Kuan Nah; Zhaowei Zhong

doi:10.1117/12.621927

12 April 2005 Finite element study of flip chip on board in drop test

Siew Kuan Nah, Zhaowei Zhong

Proceedings Volume 5852, Third International Conference on Experimental Mechanics and Third Conference of the Asian Committee on Experimental Mechanics; (2005) https://doi.org/10.1117/12.621927
Event: Third International Conference on Experimental Mechanics and Third Conference of the Asian Committee on Experimental Mechanics, 2004, -, Singapore

Abstract

The reliability of electronic packages in mechanical drop tests is critical especially for portable electronic devices as these electronic packages are very vulnerable to solder joint failures caused by the mechanical shock and the PCB warping upon impact. Drop test studies are performed to investigate the solder joints mechanical failure in electronic packages. In this paper, the mechanical impact on the solder joints of a flip chip in a simulated drop test is investigated. The drop test simulation consists of a typical flip chip on board (FCOB) that has 48 peripheral eutectic solder bumps modeled in CAD/CAM software. The flip chip solder joint reliability under mechanical shock is studied using 3D finite element simulation. Comprehensive design analyses are performed to study 3 different models. The design models are varied in the substrate dimensions and the addition of encapsulation. The results of the stresses and strains in the solder joints are obtained using finite element analysis in the drop test. The findings indicate that the stress on the flip chip corner solder joint decreases if the substrate is larger in dimension. In addition, the introduction of an encapsulation helps to reduce the stress experienced by the solder joint.

Citation Download Citation

Siew Kuan Nah and Zhaowei Zhong "Finite element study of flip chip on board in drop test", Proc. SPIE 5852, Third International Conference on Experimental Mechanics and Third Conference of the Asian Committee on Experimental Mechanics, (12 April 2005); https://doi.org/10.1117/12.621927

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