Thermal-electrical-mechanical coupled FE buckling analysis of smart plates using discrete layer kinematics

G. Giannopoulos; F. Santafe Iribarren; J. Vantomme

doi:10.1117/12.651660

27 March 2006 Thermal-electrical-mechanical coupled FE buckling analysis of smart plates using discrete layer kinematics

G. Giannopoulos, F. Santafe Iribarren, J. Vantomme

Author Affiliations +

Proceedings Volume 6166, Smart Structures and Materials 2006: Modeling, Signal Processing, and Control; 61660P (2006) https://doi.org/10.1117/12.651660
Event: SPIE Smart Structures and Materials + Nondestructive Evaluation and Health Monitoring, 2006, San Diego, California, United States

Abstract

In the present work, the non-linear analysis of smart beams and plates is performed, using FE techniques. A coupled constitutive formulation between thermal, electrical and mechanical fields is presented incorporating non-linearity due to large displacements. An 8-node plate element was implemented in combination with a discrete layer approximation (LW) for the through the thickness representation of the structure. The issues of the critical buckling load under different electrical conditions as well as thermal and electrical loading are also presented. Experimental results contribute in order to verify the numerical analysis results.

Citation Download Citation

G. Giannopoulos, F. Santafe Iribarren, and J. Vantomme "Thermal-electrical-mechanical coupled FE buckling analysis of smart plates using discrete layer kinematics", Proc. SPIE 6166, Smart Structures and Materials 2006: Modeling, Signal Processing, and Control, 61660P (27 March 2006); https://doi.org/10.1117/12.651660

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