Design and fabrication of polymer microlenses arrays for VCSELs using a cantilever based microsystem

Véronique Bardinal; Emmanuelle Daran; Corinne Vergnenègre; Thierry Leïchlé; Yvan Segui; Thierry Camps; Jean-Bernard Pourciel; Véronique Conedera; Léonard Gavin-Djidina; Mathieu Guirardel

doi:10.1117/12.662800

21 April 2006 Design and fabrication of polymer microlenses arrays for VCSELs using a cantilever based microsystem

Véronique Bardinal, Emmanuelle Daran, Corinne Vergnenègre, Thierry Leïchlé, Yvan Segui, Thierry Camps, Jean-Bernard Pourciel, Véronique Conedera, Léonard Gavin-Djidina, Mathieu Guirardel

Author Affiliations +

Proceedings Volume 6185, Micro-Optics, VCSELs, and Photonic Interconnects II: Fabrication, Packaging, and Integration; 618510 (2006) https://doi.org/10.1117/12.662800
Event: SPIE Photonics Europe, 2006, Strasbourg, France

Abstract

We report on the design and the fabrication of refractive microlenses using a polymer droplet deposition microsystem. The principle of this original technique consists in monomer droplets deposition using a robotized silicon-microcantilevers array. The advantages of this technique rely on the control of droplets dimensions and the positioning accuracy. Microlenses have been first modelled to optimize their geometrical parameters for VCSEL collimation. Results of lens optimization as well as the influence of the fabrication parameters fluctuations on the final divergence are detailed. First results on droplets deposition are presented, demonstrating the technique feasibility. Finally, the possibility of the modification of the surface energy to obtain the most suited contact angle before deposition is also discussed.

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Véronique Bardinal, Emmanuelle Daran, Corinne Vergnenègre, Thierry Leïchlé, Yvan Segui, Thierry Camps, Jean-Bernard Pourciel, Véronique Conedera, Léonard Gavin-Djidina, and Mathieu Guirardel "Design and fabrication of polymer microlenses arrays for VCSELs using a cantilever based microsystem", Proc. SPIE 6185, Micro-Optics, VCSELs, and Photonic Interconnects II: Fabrication, Packaging, and Integration, 618510 (21 April 2006); https://doi.org/10.1117/12.662800

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