Development of hybridized focal plane technologies

Michael Lesser; David Ouellette

doi:10.1117/12.670808

15 June 2006 Development of hybridized focal plane technologies

Michael Lesser, David Ouellette

Proceedings Volume 6276, High Energy, Optical, and Infrared Detectors for Astronomy II; 627603 (2006) https://doi.org/10.1117/12.670808
Event: SPIE Astronomical Telescopes + Instrumentation, 2006, Orlando, Florida , United States

Abstract

Large area focal planes for the next generation of astronomical instruments require very flat imaging surfaces (< 10 μm peak-valley) over significant sizes (20 - 100 cm), accurate alignment of detector height, stable operation at low temperature, and fully-buttable packaging with large I/O requirements to connect multiple amplifiers per detector. These requirements are often mutually exclusive and therefore difficult to obtain in a single focal plane. In this paper we discuss the hybridization or flip chip bonding technique and associated focal plane mounting methods to achieve these goals. Specifically, we describe a technique to hybridize CCD detectors onto high thermal conductivity ceramic with vias that lead to the I/O signals underneath the detectors. Packaging methods to mount such devices with a total flatness non-uniformity of less than 10 microns are presented. The requirements of achieving sub-5 microns flatness are also discussed.

Citation Download Citation

Michael Lesser and David Ouellette "Development of hybridized focal plane technologies", Proc. SPIE 6276, High Energy, Optical, and Infrared Detectors for Astronomy II, 627603 (15 June 2006); https://doi.org/10.1117/12.670808

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