Paper
20 May 2006 A study of damage mechanisms during EUV mask substrate cleaning
Author Affiliations +
Abstract
Defects on an extreme ultraviolet (EUV) mask blank strongly depend on the defects on the mask blank substrate. Any imperfection on the substrate surface in the form of a particle, pit, and scratch will appear on the EUV mask blank. In this article, we study the effect of the cleaning process on the creation of defects on the EUV substrate and mask blank. Added particles could be removed by improving the cleaning tool and the cleaning process. Pits are generally created when many large defects, particularly glass-like materials, are present on the surface and the substrate is exposed to a high energy cleaning step. Comparison of different high energy steps in a typical cleaning process suggests that the megasonic step most likely creates pits. Current cleaning processes developed in the Mask Blank Development Center (MBDC) have been optimized so that no added pits or particles are observed after using them.
© (2006) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Abbas Rastegar, Sean Eichenalub, Kurt Goncher, and Pat Marmillion "A study of damage mechanisms during EUV mask substrate cleaning", Proc. SPIE 6283, Photomask and Next-Generation Lithography Mask Technology XIII, 62830I (20 May 2006); https://doi.org/10.1117/12.681841
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Cited by 3 scholarly publications.
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KEYWORDS
Particles

Extreme ultraviolet

Glasses

Photomasks

Quartz

Atomic force microscopy

Image processing

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