Paper
20 May 2006 Optimization of TaSix absorber stack for EUV mask
Shinpei Tamura, Koichiro Kanayama, Yasushi Nishiyama, Tadashi Matsuo, Akira Tamura
Author Affiliations +
Abstract
We evaluated and optimized Ta-based absorber added by Si for EUV mask. Consequently, we confirmed TaSix based bi-layer absorber stack has the following performances; It has amorphous morphology without columnar structure advantageous to fabricate fine pattern with smaller line edge roughness. In order to realize better position accuracy, it has low internal stress capable to control. As an optical property, it has low DUV reflectance at 257nm which facilitates to perform defect inspection. As it can be etched anisotropcally by conventional halogen gases without using hard mask, we achieved almost vertical sidewall profile of 120nm lines and spaces pattern and promising CD control accuracy.
© (2006) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Shinpei Tamura, Koichiro Kanayama, Yasushi Nishiyama, Tadashi Matsuo, and Akira Tamura "Optimization of TaSix absorber stack for EUV mask", Proc. SPIE 6283, Photomask and Next-Generation Lithography Mask Technology XIII, 62830J (20 May 2006); https://doi.org/10.1117/12.681842
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Cited by 3 scholarly publications.
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KEYWORDS
Extreme ultraviolet

Silicon

Radium

Reflectivity

Inspection

Tantalum

Refractive index

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