Simulation of filling characteristics during hot embossing of polymer microstructures

Peng Jin; Yulong Gao; Tingting Liu

doi:10.1117/12.821254

12 January 2009 Simulation of filling characteristics during hot embossing of polymer microstructures

Peng Jin, Yulong Gao, Tingting Liu

Proceedings Volume 7133, Fifth International Symposium on Instrumentation Science and Technology; 71334N (2009) https://doi.org/10.1117/12.821254
Event: International Symposium on Instrumentation Science and Technology, 2008, Shenyang, China

Abstract

Hot embossing is an effective way to achieve high-quality Microstructures at low cost. At present papers, the effects of geometry and shear on filling profile and polymer deformation have studied through experiments or computations. In this paper, the parameters on different polymer deformation modes: single peak, dual peak and embossing stage have researched. Especially it is referred that the mainly reasons of embossing stage phenomenon are the ratio of cavity width to height 2w/hi, the ratio of cavity width to tool width w/(w+s), and shear thinning. In addition, the temperature variation of polymer due to internal friction has discussed with evolution of imprint speed. And the simulation results prove a better coincidence with experiments.

Citation Download Citation

Peng Jin, Yulong Gao, and Tingting Liu "Simulation of filling characteristics during hot embossing of polymer microstructures", Proc. SPIE 7133, Fifth International Symposium on Instrumentation Science and Technology, 71334N (12 January 2009); https://doi.org/10.1117/12.821254

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