CTE-matched microchannel coolers

Greg Rudd; Kalista Kusnadi; Rob Brox; Alan Grantz

doi:10.1117/12.809747

23 February 2009 CTE-matched microchannel coolers

Greg Rudd, Kalista Kusnadi, Rob Brox, Alan Grantz

Proceedings Volume 7198, High-Power Diode Laser Technology and Applications VII; 71980I (2009) https://doi.org/10.1117/12.809747
Event: SPIE LASE: Lasers and Applications in Science and Engineering, 2009, San Jose, California, United States

Abstract

Microchannel coolers (MCC's) for laser diodes are most commonly constructed of copper or copper alloy. A disadvantage of the use of these metals is their much higher coefficient of thermal expansion (CTE) compared to GaAs. This mismatch can result in stress on the devices during soldering or operation. It can also stress the solder joint, encouraging voiding. One solution is to attach the laser to an MCC made from low CTE material. Suitable examples are tungsten-copper and molybdenum-copper. We have fabricated MCC's from these materials and have performed CFD modeling followed by flow, thermal resistance, and accelerated life tests on the parts. We show that the thermal results can be achieved that compare to copper MCC's. The erosion resistance of the materials is demonstrated to be higher than copper. Life tests using DI water flow indicates that superior life can be expected from these MCC's, especially at higher flow rates of 0.5 lpm/0.13 gpm and with lower water quality and elevated temperature. Finally, we show that the dimensional tolerances required can be obtained with these material combinations.

Citation Download Citation

Greg Rudd, Kalista Kusnadi, Rob Brox, and Alan Grantz "CTE-matched microchannel coolers", Proc. SPIE 7198, High-Power Diode Laser Technology and Applications VII, 71980I (23 February 2009); https://doi.org/10.1117/12.809747

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