Paper
30 December 2008 Development of polyimide-based flexible tactile sensing module integrated with strain gauges & flexible flat cable
Kunnyun Kim, Kang Ryeol Lee, Won Hyo Kim, Kwang-Bum Park, Tae-Hyung Kim, James Jungho Pak
Author Affiliations +
Proceedings Volume 7269, Micro- and Nanotechnology: Materials, Processes, Packaging, and Systems IV; 72690P (2008) https://doi.org/10.1117/12.820053
Event: SPIE Smart Materials, Nano- and Micro-Smart Systems, 2008, Melbourne, Australia
Abstract
A flexible tactile sensing module with NiCr strain gauges as sensing elements was fabricated by polymer MEMS technology using polyimide materials where the one was the photo-definable polyimide precursor and the other was nonphoto- definable. The unit sensor cell size of 32×32 tactile sensor array was 1mm × 1mm cell and its overall size was 5.5cm × 6.5cm. Especially, both the tactile sensor arrays and the pluggable terminals as flexible flat cable were fabricated on the same polymer substrate easily to be connected the sensor array with a PCB board. The fabricated tactile sensing module was measured continuously in the normal force range of 0~1N with tactile sensor evaluation system. The value of resistance was relatively linear with normal force in the overall range of 0~1N. However, the variation of resistance was decreased by more than 0.6N. The variation rate of resistance was 2.0%/N in the range of 0~0.6N and 1.5%/N in the range of 0.6~1N. Image display was identified corresponding by distribution of applied force. The flexibility of the sensing module was adequate to be placed on any curved surface as a cylinder.
© (2008) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Kunnyun Kim, Kang Ryeol Lee, Won Hyo Kim, Kwang-Bum Park, Tae-Hyung Kim, and James Jungho Pak "Development of polyimide-based flexible tactile sensing module integrated with strain gauges & flexible flat cable", Proc. SPIE 7269, Micro- and Nanotechnology: Materials, Processes, Packaging, and Systems IV, 72690P (30 December 2008); https://doi.org/10.1117/12.820053
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KEYWORDS
Sensors

Polymers

Resistance

Metals

Connectors

Microelectromechanical systems

Optical lithography

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