Development and application of large format QWIP FPA

Yan-Li Shi

doi:10.1117/12.836519

4 August 2009 Development and application of large format QWIP FPA

Yan-Li Shi

Proceedings Volume 7383, International Symposium on Photoelectronic Detection and Imaging 2009: Advances in Infrared Imaging and Applications; 738303 (2009) https://doi.org/10.1117/12.836519
Event: International Symposium on Photoelectronic Detection and Imaging 2009, 2009, Beijing, China

Abstract

320×256 GaAs/AlGaAs Quantum Well Infrared Photodetector (QWIP) Focal Plane Array (FPA) was successfully prepared. The material design, device fabrication, performance measurement, as well as thermal imaging by the first QWIP FPA thermal imager was addressed in this paper. Further development and application of large format QWIP FPA detector was also presented. Based on the mature material growth and devices processing technology the large format III-V QWIP focal plane array was characteristic of promising mass production ability with high performance, good repeatability, good uniformity and low cost. Besides, the flexible Energy-Band Engineering of III-V QWIP technology made QWIP FPA as the advanced Third-Gen infrared detector technology now and in the future.

Citation Download Citation

Yan-Li Shi "Development and application of large format QWIP FPA", Proc. SPIE 7383, International Symposium on Photoelectronic Detection and Imaging 2009: Advances in Infrared Imaging and Applications, 738303 (4 August 2009); https://doi.org/10.1117/12.836519

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