Assembly and interconnect formation in MEMS/MOEMS application

Hermann Oppermann

doi:10.1117/12.912820

2 February 2012 Assembly and interconnect formation in MEMS/MOEMS application

Hermann Oppermann

Proceedings Volume 8250, Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices XI; 825002 (2012) https://doi.org/10.1117/12.912820
Event: SPIE MOEMS-MEMS, 2012, San Francisco, California, United States

Abstract

Integration of MEMS and MOEMS requires very compact packages with short interconnects which are found in 3D packages. We will give an overview on assembly methods like chip-to-chip, chip-to-wafer and wafer-to-wafer. For the variety of applications different interconnection methods are shown: reflow soldering, transient liquid phase bonding and transient liquid phase soldering, thermocompression and thermosonic bonding as well as sintering of silver paste or new materials like nanosponge.

Citation Download Citation

Hermann Oppermann "Assembly and interconnect formation in MEMS/MOEMS application", Proc. SPIE 8250, Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices XI, 825002 (2 February 2012); https://doi.org/10.1117/12.912820

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