Bidirectional multimode fiber interconnection

Rainer Michalzik; Alexander Kern; Dietmar Wahl

doi:10.1117/12.910485

7 February 2012 Bidirectional multimode fiber interconnection

Rainer Michalzik, Alexander Kern, Dietmar Wahl

Proceedings Volume 8276, Vertical-Cavity Surface-Emitting Lasers XVI; 82760I (2012) https://doi.org/10.1117/12.910485
Event: SPIE OPTO, 2012, San Francisco, California, United States

Abstract

We summarize the properties of 850nm wavelength AlGaAs/GaAs-based transceiver chips, monolithically integrating vertical-cavity surface-emitting lasers (VCSELs) and metal-semiconductor-metal (MSM) or PIN-type (p-doped-intrinsic-n-doped) photodiodes. Different chip designs enable half- and full-duplex bidirectional optical interconnection at multiple Gbit/s data rate over a single butt-coupled glass or polymer-clad optical fiber with core diameters ranging from 50 to 200 μm. The chips at both fiber ends are nominally identical and no external optics is required, which leads to lower cost in addition to volume and weight reduction. The commercial availability of such chips would directly enable applications in data communication and sensing networks in various environments such as automotive, home, industrial, in-building, or medical.

Citation Download Citation

Rainer Michalzik, Alexander Kern, and Dietmar Wahl "Bidirectional multimode fiber interconnection", Proc. SPIE 8276, Vertical-Cavity Surface-Emitting Lasers XVI, 82760I (7 February 2012); https://doi.org/10.1117/12.910485

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