AC properties of low-pass RC filters embedded in printed circuit boards

Paweł Winiarski; Adam Kłossowicz; Wojciech Stęplewski; Janusz Borecki; Karol Nitsch; Andrzej Dziedzic

doi:10.1117/12.2030279

25 July 2013 AC properties of low-pass RC filters embedded in printed circuit boards

Paweł Winiarski, Adam Kłossowicz, Wojciech Stęplewski, Janusz Borecki, Karol Nitsch, Andrzej Dziedzic

Proceedings Volume 8902, Electron Technology Conference 2013; 89020C (2013) https://doi.org/10.1117/12.2030279
Event: Electron Technology Conference 2013, 2013, Ryn, Poland

Abstract

Impedance Spectroscopy (IS) is a widely used measurement technique for determining the characteristics of a variety of materials and systems. Analysis of object’s AC-response can allow determine of different electrical properties due to its structure. IS can also be used to study electronic components such as gas and humidity sensors, thermistors, varistors, capacitors or resistors. The resulting impedance spectrum can be approximated by electrical equivalent circuit. However, It is difficult to find papers dedicated to the electronic systems investigated by IS method. For this reason authors analyzed properties of RC low-pass filters embedded in printed circuit boards using IS technique. These four-contact structures were made of special Ohmega/FaradFlex^® composite material. It consists of a resistive/capacitive core containing OhmegaPly RCM layer (resistive NiP alloy) laminated to FaradFlex dielectric of Oak-Mitsui company. Analysis of the measurements results using impedance spectroscopy allowed a more precise determination of the filter parameters than an analysis using standard method based on ideal components. Additionally selected filters were subjected to one of the aging process (thermal aging or thermal-humidity exposure), and found that this results in a frequency shift of the filter.

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Paweł Winiarski, Adam Kłossowicz, Wojciech Stęplewski, Janusz Borecki, Karol Nitsch, and Andrzej Dziedzic "AC properties of low-pass RC filters embedded in printed circuit boards", Proc. SPIE 8902, Electron Technology Conference 2013, 89020C (25 July 2013); https://doi.org/10.1117/12.2030279

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