Experimental study on lapping of micro groove with controlled force

Fei Ding; Bo Wang; Guo Li; Lin Che; Xing Mao

doi:10.1117/12.2069964

21 August 2014 Experimental study on lapping of micro groove with controlled force

Fei Ding, Bo Wang, Guo Li, Lin Che, Xing Mao

Proceedings Volume 9283, 7th International Symposium on Advanced Optical Manufacturing and Testing Technologies: Design, Manufacturing, and Testing of Micro- and Nano-Optical Devices and Systems; 92830O (2014) https://doi.org/10.1117/12.2069964
Event: 7th International Symposium on Advanced Optical Manufacturing and Testing Technologies (AOMATT 2014), 2014, Harbin, China

Abstract

Precision parts with complicated microstructures have been in increasing demand in the field of inertial navigation systems and structured molds. Micro milling is a direct operation to manufacture the micro structure but it will induce unexpected tool marks and deterioration layer. A novel lapping method based on controlled force is proposed as the final finishing process. The method offers efficient position determination strategy for the structure and is capable to monitor the lapping condition. In the paper, processing method and the developed lapping apparatus was firstly introduced. Then, the individual influence on finished surface of several processing parameters including abrasive size, amount of feed and lapping trajectory are investigated. Results show that the deterioration layer was successfully removed with different slurries without diminution of its original form accuracy. Lapping efficiency is also taken into account in the choosing of parameters. The formative mechanism of parallel scratches observed in experiments is analyzed and verified.

Citation Download Citation

Fei Ding, Bo Wang, Guo Li, Lin Che, and Xing Mao "Experimental study on lapping of micro groove with controlled force", Proc. SPIE 9283, 7th International Symposium on Advanced Optical Manufacturing and Testing Technologies: Design, Manufacturing, and Testing of Micro- and Nano-Optical Devices and Systems, 92830O (21 August 2014); https://doi.org/10.1117/12.2069964

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