High power diode laser stack development using gold-tin bonding technology

Dong Hou; Jingwei Wang; Pu Zhang; Lei Cai; Ye Dai; Yingjie Li; Xingsheng Liu

doi:10.1117/12.2079610

20 February 2015 High power diode laser stack development using gold-tin bonding technology

Dong Hou, Jingwei Wang, Pu Zhang, Lei Cai, Ye Dai, Yingjie Li, Xingsheng Liu

Proceedings Volume 9346, Components and Packaging for Laser Systems; 934604 (2015) https://doi.org/10.1117/12.2079610
Event: SPIE LASE, 2015, San Francisco, California, United States

Abstract

High power diode lasers have increased application in many fields. In this work, a sophisticated high power and high performance conduction cooled diode laser stack has been developed for long pulse duration and high duty cycle using gold-tin (AuSn) bonding technology. The transient thermal behavior and optical simulation of the laser diode stack module are investigated to optimize the laser device structure. CTE-matched submount and AuSn hard solder are used for bonding the laser diode bar to achieve higher reliability and longer lifetime. Guided by the numerical simulation and analytical results, conduction cooled diode laser stack with high power, long pulse duration and high duty cycle is fabricated and characterized. Compared with the conventional indium bonding technology, the new design is a promising approach to obtain improved performance with high reliability and long lifetime.

Citation Download Citation

Dong Hou, Jingwei Wang, Pu Zhang, Lei Cai, Ye Dai, Yingjie Li, and Xingsheng Liu "High power diode laser stack development using gold-tin bonding technology", Proc. SPIE 9346, Components and Packaging for Laser Systems, 934604 (20 February 2015); https://doi.org/10.1117/12.2079610

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