Topography aware DFM rule based scoring for silicon yield modeling

Vikas Tripathi; Ushasree Katakamsetty; Sky Yeo; Colin Hui

doi:10.1117/12.2085733

18 March 2015 Topography aware DFM rule based scoring for silicon yield modeling

Vikas Tripathi, Ushasree Katakamsetty, Sky Yeo, Colin Hui

Proceedings Volume 9427, Design-Process-Technology Co-optimization for Manufacturability IX; 94270V (2015) https://doi.org/10.1117/12.2085733
Event: SPIE Advanced Lithography, 2015, San Jose, California, United States

Abstract

DFM rule based scoring is associated with manufacturability rules checking and applying the scoring to predict the yield entitlement for an IC chip design. Achieving high DFM score is one of the key requirements to get high yield. The DFM scoring methodology is currently limited to DFM recommend rules and their associated failure rates. In contrast to failure mechanism, chemical-mechanical polishing (CMP) step topography variations places an important role to it. In this paper, we present an advanced DFM analysis flow to compute DFM score that incorporate topography variation along with recommend rule scoring using complex scoring model to increase silicon yield correlation.

Citation Download Citation

Vikas Tripathi, Ushasree Katakamsetty, Sky Yeo, and Colin Hui "Topography aware DFM rule based scoring for silicon yield modeling", Proc. SPIE 9427, Design-Process-Technology Co-optimization for Manufacturability IX, 94270V (18 March 2015); https://doi.org/10.1117/12.2085733

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