THERMAL analysis of high-power x-ray target: scaling effects

Xi Zhang; Vance S. Robinson; Thomas R. Raber; Mark Frontera

doi:10.1117/12.2186823

26 August 2015 THERMAL analysis of high-power x-ray target: scaling effects

Xi Zhang, Vance S. Robinson, Thomas R. Raber, Mark Frontera

Proceedings Volume 9590, Advances in Laboratory-based X-Ray Sources, Optics, and Applications IV; 95900G (2015) https://doi.org/10.1117/12.2186823
Event: SPIE Optical Engineering + Applications, 2015, San Diego, California, United States

Abstract

High resolution x-ray imaging systems require small focal spots ranging from 1 μm to 1 mm. In NDE applications, the demand for small spot sizes for high spatial resolution conflicts with the need for increased x-ray flux for faster scan times. In this paper, a finite element model is developed to compute the temperature of a stationary x-ray target exposed to micrometer-sized high power (10’s to 100’s of watts) electron beams. Such extremely high power densities at the focal spot are the limiting factor in both performance and life of many x-ray imaging system. This model is used to demonstrate the effect of focal spot size – diameter, on the heat dissipation capability. As the spot size reduces, a higher power density may be sustained by the target. This effect is explained by increased lateral heat conduction. The peak temperature of a small focal spot also becomes more sensitive to the current density distribution of the incident electron beam. The relationship of the peak power and electron beam profile, volumetric power deposition into the x-ray target and focal spot aspect ratio are discussed. Some experimental data demonstrating such scaling effects is included. General design rules for higher-flux capable targets leveraging these scaling effects are also proposed.

Citation Download Citation

Xi Zhang, Vance S. Robinson, Thomas R. Raber, and Mark Frontera "THERMAL analysis of high-power x-ray target: scaling effects", Proc. SPIE 9590, Advances in Laboratory-based X-Ray Sources, Optics, and Applications IV, 95900G (26 August 2015); https://doi.org/10.1117/12.2186823

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KEYWORDS

Electron beams

X-rays

Tungsten

Scanning electron microscopy

Finite element methods

X-ray imaging

Thermal analysis

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