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5 March 2022 X-ray optics bonding under vacuum conditions by means of laser-based soldering
Erik Beckert, Florian Mueller, Eric Wille
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Proceedings Volume PC12008, Photonic Instrumentation Engineering IX; PC1200807 (2022) https://doi.org/10.1117/12.2606141
Event: SPIE OPTO, 2022, San Francisco, California, United States
Abstract
Laser-based soldering, also known as Solderjet-bumping, is an established process for the bonding of optical and mechanical components under laboratory conditions at normal atmosphere. The present study shows the implementation and adaption of the bonding technology to a vacuum environment with pressure below 10-4 mbar, in which x-ray optics are assembled and aligned. To demonstrate the performance, assembly campaigns for x-ray optics demonstrators in air and under vacuum conditions were performed. Environmental and mechanical tests on sample-level-studies were carried out. The results of the study show that the solderjet-bumping technique is capable for the bonding of x-ray optics and other components under vacuum conditions. The strength of the bond is not affected by the vacuum environment.
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Erik Beckert, Florian Mueller, and Eric Wille "X-ray optics bonding under vacuum conditions by means of laser-based soldering", Proc. SPIE PC12008, Photonic Instrumentation Engineering IX, PC1200807 (5 March 2022); https://doi.org/10.1117/12.2606141
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KEYWORDS
X-ray optics
Laser bonding
Laser welding
X-rays
Adhesives
Atmospheric optics
Optical alignment
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