Lithography-free vertical Au/WS2/Ag Schottky-junction photovoltaic devices

Anh Thi Nguyen; Jun Wang; Eunseo Cho; Seoyoung Lim; Soyeong Kwon; Jungeun Song; Keya Zhou; Dong-Wook Kim

doi:10.1117/12.2676336

5 October 2023 Lithography-free vertical Au/WS₂/Ag Schottky-junction photovoltaic devices

Anh Thi Nguyen, Jun Wang, Eunseo Cho, Seoyoung Lim, Soyeong Kwon, Jungeun Song, Keya Zhou, Dong-Wook Kim

Author Affiliations +

Proceedings Volume PC12651, Low-Dimensional Materials and Devices 2023; PC126510T (2023) https://doi.org/10.1117/12.2676336
Event: SPIE Nanoscience + Engineering, 2023, San Diego, California, United States

Conference Poster

Abstract

WS2 multilayer flakes were prepared on template-stripped ultra-flat Ag layers using a metal-assisted exfoliation technique. Using a shadow mask consisting of holey carbon films, 2-micron-sized Au top electrodes were evaporated on the WS2 flakes to fabricate vertical Au/WS2/Ag devices. The photovoltaic characterization of the devices indicated the formation of Schottky diodes, and the estimated power conversion efficiency at 625-nm visible light was as high as 5.0%. Moreover, our Au/WS2/Ag devices exhibited broadband and incident-angle-insensitive absorption capability. The lithography-free processes suggested in this work enabled us to fabricate high-yield and high-performance devices.

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Anh Thi Nguyen, Jun Wang, Eunseo Cho, Seoyoung Lim, Soyeong Kwon, Jungeun Song, Keya Zhou, and Dong-Wook Kim "Lithography-free vertical Au/WS₂/Ag Schottky-junction photovoltaic devices", Proc. SPIE PC12651, Low-Dimensional Materials and Devices 2023, PC126510T (5 October 2023); https://doi.org/10.1117/12.2676336

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