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13 March 2024 Laser deposition and sintering for the fabrication of a multicomponent microelectronic device
Maria Canillas, Carlos Molpeceres, Miguel Angel Rodriguez, Cristina Muñoz, David Canteli, Miguel Morales
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Proceedings Volume PC12872, Laser Applications in Microelectronic and Optoelectronic Manufacturing (LAMOM) XXIX; PC128720B (2024) https://doi.org/10.1117/12.3003023
Event: SPIE LASE, 2024, San Francisco, California, United States
Abstract
The fabrication of multicomponent devices presents a challenge when facing the densification process. In the case of a microcapacitor, it involves a matrix of a dielectric componenet, such a Barium Titanate (BTO), sandwiched between electrodes for which a metallic material is commonly used. The material phases involved possesses different thermal properties which make impossible to densify at the same temperature and time. The combination of different laser technologies such as Laser-Induced Forward Transfer (LIFT) and Selective Laser Sintering (SLS) could be the key to fabricate these multicomponent devices by using digitazable technologies. In previous works the LIFT deposition and the Selective Laser Sintering of BTO has been prospected. Only superficial densification has been obtained on the dielectric component by SLS. In this work, LIFT and conventional sintering of BTO combined with the LIFT deposition and SLS of silver pastes are proposed for the fabrication of a first prototype.
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(2024) Published by SPIE. Downloading of the abstract is permitted for personal use only.
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Maria Canillas, Carlos Molpeceres, Miguel Angel Rodriguez, Cristina Muñoz, David Canteli, and Miguel Morales "Laser deposition and sintering for the fabrication of a multicomponent microelectronic device", Proc. SPIE PC12872, Laser Applications in Microelectronic and Optoelectronic Manufacturing (LAMOM) XXIX, PC128720B (13 March 2024); https://doi.org/10.1117/12.3003023
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KEYWORDS
Laser sintering
Sintering
Fabrication
Microelectronics
Silver
Laser energy
Materials properties
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