Presentation
12 March 2024 Polymer-based hybrid photonic integration for terabit optical transceivers
Author Affiliations +
Proceedings Volume PC12892, Optical Interconnects XXIV; PC128920H (2024) https://doi.org/10.1117/12.3002707
Event: SPIE OPTO, 2024, San Francisco, California, United States
Abstract
A photonic engine for the integration of multi-lane optical transceivers is presented. The building blocks are InP-based electro-absorption modulated lasers and photodiodes capable of operating at 50 GBaud with PAM-4 modulation, and a low-cost polymer waveguiding chip providing routing of the multiple lanes and connectivity towards standard single-mode fibers. An automatic process for the hybrid assembly of the different building blocks has been developed, and photonic integrated circuits with up to 16 lanes have been demonstrated. Furthermore, high-frequency flexible interconnects with bandwidths beyond 100 GHz provide a connectivity solution between photonics and high-speed electronics.
Conference Presentation
© (2024) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
David de Felipe Mesquida, Martin Kresse, Madeleine Weigel, Marcel Amberg, Michael Theurer, Tianwen Qian, Philipp Winklhofer, Klara Mihov, Jakob Reck, Csongor Keuer, Moritz Kleinert, Crispin Zawadzki, Patrick Runge, Martin Moehrle, Norbert Keil, and Martin Schell "Polymer-based hybrid photonic integration for terabit optical transceivers", Proc. SPIE PC12892, Optical Interconnects XXIV, PC128920H (12 March 2024); https://doi.org/10.1117/12.3002707
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KEYWORDS
Polymers

Transceivers

Integrated optics

Polymer optics

Chip manufacturing

Photonic integrated circuits

Polymer thick film flex circuits

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