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10 April 2024 Advanced packaging: Enabling the future of Moore's Law
Tom Rucker
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Proceedings Volume PC12956, Novel Patterning Technologies 2024; PC1295602 (2024) https://doi.org/10.1117/12.3012849
Event: SPIE Advanced Lithography + Patterning, 2024, San Jose, California, United States
Abstract
Computing requirements are driven by ever increasing needs for higher performance, lower power consumption, and smaller form factors. These trends are broadly followed in most market segments, from high-performance cloud computing and defense applications to personal computing, handheld devices, and industrial automation. Advanced packaging is critical in the relentless pursuit of Moore’s law as more and more transistors are packed into smaller, more reliable, and higher performance units. The presentation will cover the solutions that balance performance, manufacturing, and market drivers.
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Tom Rucker "Advanced packaging: Enabling the future of Moore's Law", Proc. SPIE PC12956, Novel Patterning Technologies 2024, PC1295602 (10 April 2024); https://doi.org/10.1117/12.3012849
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KEYWORDS
Advanced packaging
Moores law
Manufacturing
Silicon
Cloud computing
Defense and security
Industrial applications
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