Lithography related challenges within advanced packaging

Andy Miller

doi:10.1117/12.3011421

10 April 2024 Lithography related challenges within advanced packaging

Andy Miller

Proceedings Volume PC12956, Novel Patterning Technologies 2024; PC129560C (2024) https://doi.org/10.1117/12.3011421
Event: SPIE Advanced Lithography + Patterning, 2024, San Jose, California, United States

Abstract

Advanced Packaging and its associated technology blocks (such as hybrid bonding, BackSide Power Delivery Networks, wafer reconstruction, die embedding etc) are becoming key enablers for extending Moore’s Law and scaling in general. Given that there are multiple application spaces utilising Advanced Packaging e.g. High Performance Computing, Chiplets, wafer level packaging etc the challenges facing Lithography cover the full range of illumination wavelength approaches plus Scan & Repeat, Direct Write and Imprint Lithography. Within this presentation we will discuss the Advanced Packaging landscape, putting into context various technology blocks such as through wafer high resolution patterning, Fine Pitch Redistribution Layer (FP-RDL) patterning, through die patterning of embedded die, Chiplet options and all with respect to resolution, overlay options plus some discussion on secondary issues such as die level defectivity and distortion. We conclude with a consolidated interconnect pitch roadmap clarifying basic interconnect options.

Conference Presentation

Citation Download Citation

Andy Miller "Lithography related challenges within advanced packaging", Proc. SPIE PC12956, Novel Patterning Technologies 2024, PC129560C (10 April 2024); https://doi.org/10.1117/12.3011421

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