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14 March 2018 Opto-electronic packaging of fiber-coupled systems (Conference Presentation)
Sven Mahnkopf, Tom Haslett, Apurva Jain
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Proceedings Volume 10513, Components and Packaging for Laser Systems IV; 105130A (2018) https://doi.org/10.1117/12.2287956
Event: SPIE LASE, 2018, San Francisco, California, United States
Abstract
Challenges and resolution approaches of fiber coupling to and from optical devices will be discussed. Particular emphasis will be paid to hermetic and ruggedized assemblies.
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© (2018) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
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Sven Mahnkopf, Tom Haslett, and Apurva Jain "Opto-electronic packaging of fiber-coupled systems (Conference Presentation)", Proc. SPIE 10513, Components and Packaging for Laser Systems IV, 105130A (14 March 2018); https://doi.org/10.1117/12.2287956
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KEYWORDS
Packaging
Fiber couplers
Laser packaging
Optical components
Optical design
Optoelectronic packaging
Reliability
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