Paper
8 July 2019 Study on 532nm and CO2 laser processing of fused silica glass
Xiurong Du, Yuancheng Sun, Xiaoqiang Zhang, Xuefu Song, Bo Fu, Ning Hua
Author Affiliations +
Proceedings Volume 11063, Pacific Rim Laser Damage 2019: Optical Materials for High-Power Lasers; 110630T (2019) https://doi.org/10.1117/12.2540722
Event: Pacific Rim Laser Damage 2019 and Thin Film Physics and Applications 2019, 2019, Qingdao, China
Abstract
The fused silica glass is widely used in the photoelectricity and semiconductor industry, and needed to be cut or made small holes and micro grooves on it. Recent reports indicate that laser processing is one of important means for fused silica glass. First of all, the laser processing characteristics of fused silica glass was discussed in this paper. Besides, 532nm wavelength and CO2 laser were used to process or cut fused silica glass, and different results were found. 532nm laser is more suitable for processing holes and micro grooves on thin fused silica glass. Then CO2 laser can be used to cut thick fused silica plate or marked on the glass surface. In addition, the two laser machined surface was observed with 3D microscope, and it displays huge surface differences. The first one is rough, and another is smooth.
© (2019) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Xiurong Du, Yuancheng Sun, Xiaoqiang Zhang, Xuefu Song, Bo Fu, and Ning Hua "Study on 532nm and CO2 laser processing of fused silica glass", Proc. SPIE 11063, Pacific Rim Laser Damage 2019: Optical Materials for High-Power Lasers, 110630T (8 July 2019); https://doi.org/10.1117/12.2540722
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KEYWORDS
Laser cutting

Glasses

Carbon monoxide

Silica

Laser marking

Pulsed laser operation

Laser processing

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