The detector/readout-electronics assembly of the eXTP wide field monitor

F. Zwart; R. Tacken; J. J. M. in't Zand; R. de la Rie; M. Limpens; C. Kochanowski; G. Aitink-Kroes; C. van Baren; J. Bayer; D. Baudin; F. Ceraudo; Y. Evangelista; M. Feroci; M. Frericks; J.-L. Gálvez; O. Gevin; M. Hernanz; A. Hormaetxe; P. Laubert; A. Meuris; J. Nab; J. Neelis; C. Tenzer; C. Vogel; G. Zampa

doi:10.1117/12.2629406

31 August 2022 The detector/readout-electronics assembly of the eXTP wide field monitor

F. Zwart, R. Tacken, J. J. M. in't Zand, R. de la Rie, M. Limpens, C. Kochanowski, G. Aitink-Kroes, C. van Baren, J. Bayer, D. Baudin, F. Ceraudo, Y. Evangelista, M. Feroci, M. Frericks, J.-L. Gálvez, O. Gevin, M. Hernanz, A. Hormaetxe, P. Laubert, A. Meuris, J. Nab, J. Neelis, C. Tenzer, C. Vogel, G. Zampa

Author Affiliations +

Proceedings Volume 12181, Space Telescopes and Instrumentation 2022: Ultraviolet to Gamma Ray; 1218167 (2022) https://doi.org/10.1117/12.2629406
Event: SPIE Astronomical Telescopes + Instrumentation, 2022, Montréal, Québec, Canada

Conference Poster

Abstract

One of the four instruments on the Chinese-European enhanced x-ray timing polarimetry (eXTP) mission is the wide field monitor (WFM), consisting of six coded aperture cameras. The detector plane of each camera is comprised of four 7x7 cm² silicon drift detectors assembled with similarly sized hybrid circuit board that contain the front-end electronics (FEE) to read out the detectors. The whole assembly needs to be positioned and kept stable within ~50 micron to guarantee the scientific performance of the WFM. The FEE will have analogue ASICs to perform the read-out process. These bare dies are connected to the detector anode output pads. The detector cathodes need to be provided with voltages down to−1300V. Electrical connections between detector, ASICs and FEE are made by bond wires. The hybrid circuit board is a thick film circuit based on 96% Al₂O₃ which has a coefficient of thermal expansion that is sufficiently close to that of the silicon detector to avoid misalignment due to the large variations in temperature (−50/+60 °C) during assembly and flight. All materials, components and manufacturing processes will have to be without technology originating from the USA. For eXTP’s phase B, we are developing a demonstration model. For this, an early generation ASIC (‘IDeF-X HDBD’) is employed as well as some components that are US-made but for which there is path to European alternatives. The FEE manufacture and the assembly is already completely non-US. We outline the detector/electronics assembly and discuss the main challenges involved.

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F. Zwart, R. Tacken, J. J. M. in't Zand, R. de la Rie, M. Limpens, C. Kochanowski, G. Aitink-Kroes, C. van Baren, J. Bayer, D. Baudin, F. Ceraudo, Y. Evangelista, M. Feroci, M. Frericks, J.-L. Gálvez, O. Gevin, M. Hernanz, A. Hormaetxe, P. Laubert, A. Meuris, J. Nab, J. Neelis, C. Tenzer, C. Vogel, and G. Zampa "The detector/readout-electronics assembly of the eXTP wide field monitor", Proc. SPIE 12181, Space Telescopes and Instrumentation 2022: Ultraviolet to Gamma Ray, 1218167 (31 August 2022); https://doi.org/10.1117/12.2629406

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