Machining and modeling of high-quality reliefs in steel with pulsed-CO2-laser radiation

Andreas Penz; Stephan Fazeny; Dieter Schuoecker

doi:10.1117/12.309514

3 June 1998 Machining and modeling of high-quality reliefs in steel with pulsed-CO₂-laser radiation

Andreas Penz, Stephan Fazeny, Dieter Schuoecker

Proceedings Volume 3274, Laser Applications in Microelectronic and Optoelectronic Manufacturing III; (1998) https://doi.org/10.1117/12.309514
Event: Optoelectronics and High-Power Lasers and Applications, 1998, San Jose, CA, United States

Abstract

Machining of reliefs is a fairly new laser application and on the verge of industrial usage. The main problem is that the surface quality degrades with increasing ablation rate. Experiments and simulations are carried out to improve the process. It will be shown that fine structures and excellent surface qualities can be achieved with CO₂ lasers. For rapid tooling a complex 3D relief for embossing and stamping applications will be presented. The machining process of reliefs in steel is described by a mathematical model. The ablation geometry is calculated analytically by the temperature field due to pulsed laser radiation. As working gas a mixture of oxygen and nitrogen is used. The oxidation process plays a vital role in the laser ablation process and will be discussed in more detail. The molten film of oxidized and non-oxidized material at the ablation front is described as a stationary boundary layer flow. The thickness of the oxidized layer determined the ablation process significantly, e.g. absorption increases with an oxidized layer rapidly. To determine the absorption of the laser radiation, the interferences between the oxidized and the non-oxidized melt films are investigated. A comparison between the calculated and the machined ablation geometry shows a good correspondence for mild steel.

Citation Download Citation

Andreas Penz, Stephan Fazeny, and Dieter Schuoecker "Machining and modeling of high-quality reliefs in steel with pulsed-CO₂-laser radiation", Proc. SPIE 3274, Laser Applications in Microelectronic and Optoelectronic Manufacturing III, (3 June 1998); https://doi.org/10.1117/12.309514

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